sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 1/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate attention observe precautions for handling electrostatic discharge sensitive devices notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.2(0.008") unless otherwise noted. 3. specifications are subjec t to change without notice. package schematics features 3.45mm x 3.45mm x 2.0mm smd led zener diode provided for esd protection ir-reflow compatible white ceramic package with silicone resin standard package: 1,000pcs / reel msl (moisture sensitivity level): 1 rohs compliant
sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 2/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate absolute maximum ratings at t a =25c part number emitting color (material) lens-color viewing angle 2 1/2 [2] code. min. max. typ. XZDG10X160S green (ingan) water clear b13* 80* 90* 99.7* 120 b14* 90* 100* c1* 100* 120* v (lm) [2] cie127-2007* (i f =350ma) c2* 120* 140* notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. luminous intensity / luminous flux: +/-15%. * luminous flux is in accord ance with cie127-2007 standards . parameter symbol value unit dc forward current [1] i f 500 ma peak forward current [2] i fm 800 ma reverse voltage v r 5 v operating temperature top -40 to +100 c storage temperature tstg -40 to +120 c junction temperature [1] t j 120 c thermal resistance [1] (junction/ambient) r th j-a 90 c/w thermal resistance [1] (junction/solder point) r th j-s 20 c/w power dissipation p d 1.9 w electrical / optical characteristics at t a =25c parameter symbol value unit wavelength at peak emission cie127-2007* i f = 350ma [typ.] peak 520* nm dominant wavelength cie127-2007* i f = 350ma [typ.] dom [1] 530* nm spectral bandwidth at 50% rel max i f = 350ma [typ.] 35 nm allowable reverse current [max.] i r 85 ma forward voltage i f = 350ma [min.] v f [2] 2.7 v forward voltage i f = 350ma [typ.] 3.3 forward voltage i f = 350ma [max.] 3.8 temperature coefficient of peak i f = 350ma, -10 c t 100 c [typ.] tc peak 0.04 nm/c temperature coefficient of dom i f = 350ma, -10 c t 100 c [typ.] tc dom 0.03 nm/c temperature coefficient of v f i f = 350ma, -10 c t 100 c [typ.] tc v -1.8 mv/c notes: 1. wavelength: +/-1nm. 2. forward voltage: +/-0.1v. 3. wavelength value is trac eable to cie127- 2007 standards. notes: 1. results from mounting on metal core pcb, mounted on pc bo ard-metal core pcb is recommend for lowest thermal resistance. 2. 1/10 duty cycle, 0.1ms pulse width. 3. a relative humidity between 40% and 60% is recommended in esd-protected wo rk areas to reduce static build up during assembly pr ocess (reference jedec/jesd625-a and jedec/j-std-033)
sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 3/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate XZDG10X160S green
sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 4/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate heat generation: 1.thermal design of the end product is of paramount importance. please consider the heat generation of the led when making the system design. the coefficient of temperature increase per input electric po wer is affected by the thermal resistance of the circuit board and density of led placement on the board ,as well as other components. it is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. 2.please determine the operating current with consideration of th e ambient temperature local to the led and refer to the plot of permissible forward current vs. ambien t temperature on characteristics in this specification. please also take meas ures to remove heat from the area near the led to improve the operational characteristics on the led. 3.the equation indicates correlation between t j and t a ,and the equation indicates correlation between t j and t s t j = t a + r thj-a *w ??? tj = t s + r thj-s *w ??? tj = dice junction temperature: c t a = ambient temperature:c t s = solder point temperature:c r thj-a = heat resistance from dice junction temperature to ambient temperature : c/ w r thj-s = heat resistance from dice junction te mperature to ts measuring point : c/ w w = inputting power (ifx vf) : w
sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 5/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate ? reflow soldering is recommended and th e soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product. ? tape specification (units : mm) ? recommended soldering pattern (units : mm; tolerance: 0.1) ? the device has a single mounting surface. the device must be mounted according to the specific ations. reel dimension
sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 6/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate packing & label specifications terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp ? xzxxx160x
sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 7/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate handling precautions compare to epoxy encapsulant that is hard and brittle, s ilicone is softer and flexible . although its characteristic significantly reduces thermal stress, it is more susc eptible to damage by external mechanical force. as a result, special handling precautions need to be ob served during assembly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone le ns surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing exposed leds. impact may scratch the silicone lens or damage the internal circuitry. 5. as silicone encapsulation is permeable to gases, some corrosive substances such as h 2 s might corrode silver plating of lead- frame. special care should be taken if an led with silicone encapsulation is to be used near such substances. 4.1. there should be enough space inside the nozzle to avoid contact with the dome lens during pick up. 4.2. the inner diameter of the smd pickup nozzle should not exceed the size of the led to prevent air leaks. 4.3. a pliable material is suggested for the nozzle tip to av oid scratching or damaging the led surface during pickup. 4.4. the dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production.
sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 8/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate level floor life soak requirements standard accelerated equivalent time conditions time (hours) conditions time (hours) conditions 1 unlimited 30 c / 85% rh 168 + 5 / - 0 85 c / 85% rh esd protection during production electric static discharge can result when static-sensitive products come in contact with the operator or other conductors. the following procedures may de crease the possibility of esd damage: 1.minimize friction between the product an d surroundings to avoid static buildup. 2.all production machinery and test inst ruments must be electrically grounded. 3.operators must wear anti-static bracelets. 4.wear anti-static suit when entering work areas with conductive machinery. 5.set up esd protection areas using grounded metal plating for component handling. 6.all workstations that handle ic and es d-sensitive components must maintain an electrostatic potential of 150v or less. 7.maintain a humidity level of 50% or higher in production areas. 8.use anti-static packaging for transport and storage. 9.all anti-static equipment and procedures should be period ically inspected and evaluated for proper functionality. sunled recommends keeping the leds in the sealed moisture-barrier packaging until immediately prior to use. any unused leds sho uld be re- turned to the moisture-barrier bag and closed immediately after use. designing the position of led on a board. 1.no twist/warp/bent/or other stress shall be applied to the board after mounting led with solder to avoid a crack of led package. refer to the following recommended position and direction of led. appropriate led mounting is to place perp endicularly against the stress affected side . 2.depending on the position and direction of led,the mechanical stress on the led package can be changed. refer to the following figure. 3.do not split board by hand.split with exclusive special tool. 4.if an aluminum circuit board is used,a large stress by thermal shock might cause a solder crack. for this reason,it is recommended an appropriate verifica tion should be taken before use. jedec moisture sensitivity:
sep 17, 2016 xdsb7950 v3-z layout: maggie l. p. 9/9 part number: XZDG10X160S 3.45x3.45mm smd led with ceramic sub- strate failure criteria item symbol test conditions criteria for judgement min. max. forward voltage v f i f = 350ma - initial level x 1.1 luminous flux v i f = 350ma initial level x 0.7 - note: the test is performed after the board is cooled down to the room temperature. reliability test items and conditions the reliability of products shall be satisfied with items listed below lot tolerance percent defective (ltpd) : 10% no. test item standards test condition test times / cycles number of damaged 1 continuous operating test - ta =25c +10/-5c ,rh=55+/-20%rh if = maximum rated current* 1,000 h 0 / 22 2 high temp. operating test - ta = 100c(+/-10c) if = maximum rated current* 1,000 h 0 / 22 3 low temp. operating test - ta = -40c+3/-5c if = maximum rated current* 1,000 h 0 / 22 4 high temp. storage test jeita ed- 4701/200 201 ta = 100c(+/-10c) ta = maximum rated storage tempera- ture 1,000 h 0 / 22 5 low temp. storage test jeita ed- 4701/200 202 ta = -40c+3/-5c 1,000 h 0 / 22 6 high temp. & humidity storage test jeita ed- 4701/100 103 ta = 60c+5/-3c, rh = 90+5/-10%rh 1,000 h 0 / 22 7 high temp. & humidity operating test - ta = 60c+5/-3c, rh = 90%+5/-10%rh if = maximum rated current* 1,000h 0 / 22 8 resistance to soldering heat (reflow soldering) jeita ed- 4701/300 301 tsld=260c,10sec 2 times 0 / 22 9 solderability (reflow soldering) jeita ed- 4701/303 303a tsld=245c+/-5c,5+/-1sec 1 time over 95% 0 / 22 11 temperature cycle jeita ed- 4701/100 105 -40c(30min) ~25c(5min)~100c (30min) ~25c(5min) 100cycles 0 / 22 12 thermal shock test mil-std-202g ta = -40c(15min) ~100c(15min) 500 cycles 0 / 22 13 electric static discharge (esd) jeita ed- 4701/300 304 c = 100pf , r= 1.5k v = 8000 v 3 times negative/positive 0 / 22 note : refer to forw ard current vs. derating curve diagram . 14 vibration test jeita ed- 4701/400 403 100~2000~100hz sweep 4min. 200m/s2 3directions,4cycles 48min. 0 / 22 10 temperature cycle operating test - -40c(30min) ~25c(5min)~100c (30min) ~25c(5min) if = derated current at 100c 10cycles 0 / 22
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